For 40 years, chips got faster essentially for free. Then physics said 'no more.' Everything about modern chip design is now downstream of that moment.
From 1974 to about 2006, transistors shrank on a predictable cadence, and something magical happened: as they got smaller, they also got faster and used proportionally less power. This is Dennard scaling. Every generation, chip designers got a free lunch: more transistors, higher clocks, same power budget.
Below about 65nm, transistors started leaking. Current bled through the gate even when it was "off." You couldn't lower voltage anymore without leakage overwhelming the savings. Power per transistor stopped falling.
So even though transistors kept shrinking, you could no longer power all of them at once. Enter the dark silicon problem: a chip might have 10 billion transistors, but at any given moment, only a fraction can be active without melting the chip.
Since 2006, performance gains have come from:
Every watt a chip consumes must be removed as heat. A modern flagship CPU dissipates 250W in ~600 mm² of silicon. That's a power density higher than a stovetop burner. Cooling is now a first-class chip design constraint, not an afterthought.
This is why phone chips throttle. Why data centers are built next to rivers. Why NVIDIA's H100 costs $30K partly for the packaging and cooling. Why liquid cooling is coming to consumer PCs. It all traces back to Dennard.
None of these are silver bullets. All of them are attempts to work around the same fundamental constraint: you can only move so many electrons through so much silicon before it melts.